Overview

QCS 8250 development kit latest offering from VVDN is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm®’s QCS8250 IoT Octa-core SoC) and Carrier Board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSI

The system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, Video collaboration, retail self checkout, AR/VR, health care, fleet management, Digital signage and other AI applications on the edge.

Highlighted Features

  • Powerful specialized processing cores based SOM
  • Android 10 based OS
  • Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
  • Dedicated computer vision engine
  • Multiple interfaces options for connectivity, camera, and Display
  • Ultra compact form factor
*Mechanical enclosure option is also available alongside development kit.

Technical Specifications

Processor
  • QCS8250
Display Interface
  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 4K @ 60 Hz
Camera Interface
  • 6x 4-lane MIPI CSI
  • Qualcomm® Spectra™ 480 image signal processor
Memory
  • 8GB LPDDR5 + 128GB UFS
Video Performance
  • QCS 8250 - Encode: 8K30/4K120 Decode: 8K60/4K240
Wi-Fi
  • WLAN 2 x 2 802.11ax with DBS (QCA6391)
Bluetooth
  • Bluetooth 5.1
Sensor Core Interface
  • SPI, I2C, GPIO
I/O Interface
  • 2x240 pin board to board connector
OS
  • Android 10
Form Factor
  • L 52mm x W 52mm
Interface with SOM
  • 2x 240 pins B2B Connector
Camera
  • 6 x MIPI CSI (4 Lanes)
Ethernet
  • RJ45 (10/100/1000Mbps)
USB Connectivity
  • 1X USB 3.1 Type C with Display port
  • 2X USB 2.0 Type A (Host Only)
Storage
  • Micro SD card Connector
Display interfaces
  • 1x MIPI DSI for HDMI Out / Display connectivity
I/O Interface
  • UART, I2C, SPI, configurable GPIOs, CAN provision, Additional GPIO header
M.2 connector
  • For 4G/5G Module (PCIe/USB Interface)
Power In
  • 12V DC
Audio out/In
  • 3.5mm Head Phone Jack with Mic option
  • 6 microphone, stereo speaker (upto 4W)
Debug
  • Debug console through Micro USB
Form factor
  • L 170 mm x W 132mm
*Qualcomm QCS8250 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

TARGETED APPLICATIONS

QCS8250 SOM compact size and features make it the best to facilitate a cost-effective and efficient system to which next-gen camera modules can be interfaced for various AI-based applications:

Smart Camera
SMART CAMERA
Connected Healthcare
Connected Healthcare
Smart Retail
Smart Retail
Digital Signage
Digital Signage
Fleet Management
Fleet Management
AI Connected Cameras
AI Connected Cameras
Smart city/Traffic
Automotive
video conferencing
VIDEO CONFERENCING SYSTEM

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