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Overview

VVDN-QCS610/QCS410 development kit is a compact and powerful solution for advanced visual intelligence applications. The development kit is a combination of the powerful Qualcomm® QCS610 / QCS410 SoC and carrier board developed by VVDN.

The development kit provides a platform for the full evaluation of the Qualcomm® QCS610/QCS410 SoC with a built-in Neural Processing Engine for on-device edge AI capabilities.

It offers tight system integration and optimization for superior performance and power management with multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 via the dedicated Qualcomm® WCN3980 chipset. The native Ethernet interface is also facilitated for reliable high-speed connectivity.

The development kit comes with a pre-built Linux BSP, and an open frame carrier board exposing all the rich I/O peripherals, and supports Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, and Sony IMX462 based Full HD MIPI CSI-2 camera module offered by e-con Systems.

The development kit is suitable for all the visual intelligence applications and perform the analytics on the edge without the power of the cloud. Some of the applications include intelligent surveillance, smart retail, 180° dual-camera stitching, advanced tracking algorithms, video conferencing system, AI connected cameras, driver monitoring system (DMS), automotive, etc and many more.

SoM – Qualcomm® QCS610/QCS410 based development kit comprises of:

Technical Specifications

Processor
  • Qualcomm® QCS610/QCS410 SoC
CPU Qualcomm® Kryo™ 460 CPU
  • Kryo Gold: Dual High-Performance Cores 2.2 GHz
  • Kryo Silver: Hexa Low-Power Cores 1.8 GHz
GPU
  • Qualcomm® Adreno™ GPU 612 with 64-Bit Addressing; 845 MHz
Audio Codec
  • Low Power Stereo Codec With Headphone Out
Connectivity
  • Wi-Fi 802.11a/b/g/n/ac
  • Bluetooth 5.0
  • USB 3.1 Type C
  • USB 2.0 Type A
  • M.2 Connector (Optional LTE Module)
Memory & Storage
  • LPDDR4x (4GB)
  • Micro SD Card (SD3.0)
  • eMMC (16 GB)
Camera Module Interface
  • MIPI CSI(x3)
Camera Module Supported
  • 4K ultra low light camera based on Sony Starvis IMX415 sensor
  • Full HD ultra low light camera based on Sony Starvis IMX462 sensor
Display Interfaces
  • 7” Display (Optional LCD), Support 1920x1080p at 60 fps
  • HDMI Output
Communication Interfaces
  • 10/100/1000 Mbps Ethernet
  • Micro USB (Debugging)
Digital Interfaces
  • I2C, SPI, UART, SLIMBUS & Configurable GPIOs
Video Applications Performance
  • Encode: 4K30 8-bit H.264/HEVC/VP8
  • Decode: 4K30 8-bit H.264/HEVC/VP8/VP9
LEDs
  • To Indicate Boot & Power Status Of The Board
Form Factor
  • l x b: 55 mm x 35.5 mm (SoM)
  • l x b: 140 mm x 100 mm (Carrier Board)
Power Supply
  • 12V DC
  • Battery Powering Option

Targeted Applications

Its compact size and features make it the best to facilitate a cost-effective and efficient system to which next-gen camera modules can be interfaced for various AI-based applications:

Employees
Security Surveillance
Applications
Design
Smart Retail
Applications
Manufacturing
Smart city/Traffic
applications
Countries Global
video conferencing
system
Years of R&D Experience
AI Connected
Cameras
Countries Global
Edge AI Computing
Platforms
Countries Global
360° Panoramic
Cameras
Countries Global
Dash
Cameras
Countries Global
Driver Monitoring
Systems (DMS)

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