VVDN has designed and developed SOM based on the Qualcomm® Dragonwing™ SoC QCS6490. The SOM supports a wide range of interfaces, including camera support with up to 4K30 encoding & up to 4K60 decoding capabilities. It also offers extensive peripherals connectivity, such as 4x4 lane MIPI CSI for cameras, 4x4 lane MIPI DSI for displays, USB 3.1 Type C,USB 2.0 and more.

The SOM provides comprehensive hardware interfaces and software SDKs, enabling rapid prototyping and validation. It is ideally suited for a broad range of industrial, robotics, edge AI, and smart vision solutions.

Technical Specifications

Features Description
Platform
  • QCS6490
CPU
Qualcomm® Kryo™ 460 CPU
  • Qualcomm® Kryo™ 670 CPU
  • QCS6490 Gold+ (2.7 GHz); Gold (3x2.4 GHz); Silver (4x 1.9 GHz)
Memory
  • 4GB LPDDR4x+64GB eMMC 5.1 Flash
Connectivity
  • WLAN: Wi-Fi 6E (802.11ax)
  • 2x External SMA Wi-Fi Whip Antenna
  • Bluetooth® 5.2
Camera Interfaces
  • MIPI-CSI: 4x4-lane CSIs (4/4/4/4 ) Support, 36 + 22 MP at 30 fps/3x22 MP at 30 fps ZSL
Display Interfaces
  • MIPI-DSI: One 4-lane DSI D-PHY Support
  • Type-C with Display Port v1.4
Video Performance
  • Up to 4K30 Encode for H.264/H.265
  • Up to 4K60 Decode for H.264/H.265/VP9
Audio Interface
  • 2x Soundwire
  • 2x DMIC
  • MI2S
  • I2S
Other Interfaces
  • 1x PCIe Gen3 1-lane for Wi-Fi
  • 1x PCIe Gen3 2-lane for NVMe
  • 1x USB3.1 Type C
  • 1x USB 2.0
  • SD v3.0 4 Bit for SD Card
  • UART, I2C, SPI, I3C, GPIOs
OS
  • Linux, Windows, Android
Form Factor
  • 46mm X 49mm
Carrier Board Interface
  • LGA Pads

Targeted Applications

QCS6490 SoM's compact size and features make it the best to facilitate a cost-effective and efficient system in which next-gen camera modules can be interfaced for various AI-based applications:

Rugged Handheld

Retail POS

Smart Warehousing

AI Edge Box

Robotics & Drones

Smart Cameras

Other Offerings on Qualcomm